Forwarded: Science and Technology Innovation Highlights | Diversified Approaches to Enhance Services, Precise Services to Boost Innovation

May 15, 2025, marks the 19th “Government Transparency Day” across the province. Centered around the event theme of “Deepening Government Transparency and Supporting Decisive Victory,” the Shenyang Science and Technology Innovation Service Center took government transparency as an opportunity and, in conjunction with the promotion of Shenyang’s science and technology innovation policies and the needs of enterprise support services, conducted a special research and field visit. The company targeted in this survey was Pengcheng Micro- and Nano-Technology (Shenyang) Co., Ltd. The purpose of the survey is to publicize the achievements made in building Shenyang’s science and technology innovation platforms, the sharing of resources among science and technology infrastructure platforms, and the implementation results of the innovation voucher policy. It also aims to promote the collaborative development of Shenyang’s science and technology intermediary service alliance, further optimize the business environment, and help enterprises achieve breakthroughs in innovation.

Thin-film deposition equipment

Classification of Thin-Film Deposition Equipment: Thin-film deposition refers to the process of depositing a thin film material onto a substrate such as a silicon wafer. The materials typically deposited include non-metallic substances like silicon dioxide, silicon nitride, and polycrystalline silicon, as well as metals such as copper. The deposited films can be amorphous, polycrystalline, or single-crystal.

Exhibition Invitation | Pengcheng Semiconductor cordially invites you to the 7th Global Semiconductor Industry (Chongqing) Expo.

The 7th Global Semiconductor Industry (Chongqing) Expo will be held from May 8 to 10, 2025, at the Chongqing International Expo Center. With the theme “New Era—Creating a Chip-Fueled Future,” the expo will feature an exhibition area of 40,000 square meters, attract 800 participating companies, and draw 35,000 professional visitors for networking and exchange.

Pengcheng Semiconductor has been honored as a National High-Tech Enterprise, paving the way for a new journey in nanoscale and atomic manufacturing technologies.

In today’s era of rapid technological advancement, the semiconductor industry—serving as the cornerstone of modern information technology—is continuously driving innovation and transformation across various fields. Recently, Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. has successfully been recognized as a National High-Tech Enterprise, thanks to its outstanding technological innovation capabilities and remarkable contributions to the semiconductor sector. This prestigious honor not only recognizes Pengcheng Semiconductor’s past efforts but also officially attests to its leading position in the fields of nano- and atomic-scale manufacturing technologies.

Semiconductor manufacturing and advanced packaging continue to gain momentum.

Thanks to strong policy support, cyclical industry changes, innovation-driven growth, and the accelerated promotion of domestic substitution, the localization rate has significantly increased across multiple sub-sectors—from IC design and wafer fabrication and packaging/testing to equipment and materials. This marks that China’s semiconductor industry is steadily moving toward greater self-reliance and controllability.

Pengcheng Semiconductor showcases TGV/TSV/TMV technologies at the Shanghai Photonics Expo in Munich.

The Munich Shanghai Photonics Expo is widely regarded as the annual highlight of the laser, optics, and optoelectronics industries in Asia. Since its inaugural edition held in Shanghai in 2006, the event has steadily grown in scale and influence, emerging as a key global platform for exchange within the optoelectronics sector. The Munich Shanghai Photonics Expo will be held from March 20 to 22, 2025, at the Shanghai New International Expo Center (No. 2345 Longyang Road, Pudong New Area, Shanghai). At that time, Pengcheng Semiconductor will showcase its cutting-edge thin-film deposition equipment and technology solutions at Booth 4631 in Hall E4. Our products are based on PVD and CVD technologies, which leverage nanoscale and atomic-level manufacturing techniques to produce high-quality thin films. For example, we employ magnetron sputtering for the preparation of single-crystal thin films and utilize magnetron sputtering as a beam source for molecular-beam epitaxy. The exhibits cover popular application areas such as micro- and nano-optics, acoustics, and medical technologies. This year’s Munich Shanghai Photonics Expo will present you with the latest technologies and products. We cordially invite both new and existing customers to visit our booth and engage in discussions and exchanges!

Pengcheng Semiconductor’s TGV technology for glass substrates is boosting advanced packaging.

In the field of advanced packaging, whether it’s the interposer used in 2.5D packaging or the through-silicon vias (TSVs) employed in 3D packaging, TSVs have long been a key component. However, recently, many people have started hearing about a new term: Through Glass Vias (TGV). With its enormous potential, Through Glass Vias (TGV) could become a staple in advanced packaging technologies in the future. This article provides a brief overview of the applications and development trends of Through Glass Vias (TGV) in advanced packaging, as well as an introduction to the associated manufacturing processes.

Production-oriented TGV/TSV/TMV

The production-type TGV/TSV high-vacuum magnetron sputtering coating system is designed for coating high-density through-holes and blind holes on glass substrates and ceramic substrates, with aspect ratios exceeding 10:1. For example, this equipment is used in the substrate coating process to deposit Cu/Ti microstructures and Au/TiW dual-layer films for transmission lines, thereby supporting the enhancement of integration density in microsystems.

Great News! We warmly congratulate Pengcheng Semiconductor on receiving the National Invention Patent Certificate.

We warmly congratulate Pengcheng Semiconductor on the authorization of its invention patent, “A Plug-in Valve and a Vertical Dual-Chamber Hot-Wire CVD System,” by the National Intellectual Property Administration, and on receiving the National Invention Patent Certificate on December 10, 2024.

Principle of Vacuum Coating Equipment

A vacuum coating machine is an advanced surface treatment technology device that can deposit one or more thin films onto the surfaces of various materials, endowing the substrate with new properties such as enhanced wear resistance, corrosion resistance, and improved optical performance. The operating principle of a vacuum coating machine is primarily based on Physical Vapor Deposition (PVD) technology, which involves a variety of physical processes including vacuum technology, thermal evaporation, and sputtering.