Pengcheng Semiconductor Debuts at the High-End Professional Exhibition “Optoelectronics + Semiconductors”—Shenzhen’s 26th China International Optoelectronic Exposition

When the “light-speed” innovation of optoelectronics meets the “subtle” breakthroughs in semiconductors, two high-end, specialized exhibitions—leading global industrial collaboration—are crossing boundaries and shining brightly in Shenzhen.
On September 10, the 26th China International Optoelectronics Expo (CIOE) and SEMI-e Shenzhen International Semiconductor Exhibition, together with the 2025 Integrated Circuit Industry Innovation Expo, made their debut at the Shenzhen International Convention and Exhibition Center. With an exhibition area exceeding 300,000 square meters, this event brings together more than 5,000 exhibitors and is expected to attract 160,000 professional visitors. It sets a new benchmark for the synergistic development of the optoelectronics and semiconductor industries, injecting strong momentum into the global tech sector as it breaks through technological barriers and ignites innovation.

As a pioneering force in the semiconductor industry, Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (Hereinafter referred to as “ Pengcheng Semiconductor This time, we’re making a stunning debut with a variety of core products and cutting-edge technologies developed entirely in-house, based on nanotechnology and atomic manufacturing. PVD / CVD Technology for high-quality thin-film preparation. Use... Magnetron sputtering The technology is used for preparing single-crystal thin films, with magnetron sputtering employed for this purpose. Molecular Beam Epitaxy beam sources, etc. The magnetron sputtering technique is used to address aspect ratios greater than... 10:1 microporous coating 。

Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine Coating for high-density through-holes and blind holes on glass substrates and ceramic substrates, with aspect ratios exceeding 10:1. For example, the Cu/Ti microstructure used in substrate coating processes and the Au/TiW dual-layer film deposition capability for transmission lines provide support for enhancing the integration density of microsystems.

Advantages: High uniformity and repeatability of the film layer, strong adhesion of the film layer, and programmable automated control of the equipment based on the process recipe.
Hot-Filament Chemical Vapor Deposition (HFCVD) Equipment It can be used to fabricate microcrystalline and nanocrystalline diamond films, conductive diamond films, and corrosion-resistant, wear-resistant hard coatings. It finds wide applications in areas such as cemented carbide-based diamond-coated tools, diamond film deposition on the inner bores of ceramic bearings, and corrosion-resistant conductive diamond electrodes for wastewater treatment in environmental protection fields.
The Hot-Filament Chemical Vapor Deposition (HFCVD) equipment is driving industrial upgrades: Its advanced technology in the growth of polycrystalline diamond wafers can facilitate technological advancements across related industries. In the semiconductor industry, high-quality polycrystalline diamond wafers can serve as next-generation semiconductor materials, propelling semiconductor devices toward higher performance and lower power consumption, thereby enhancing the competitiveness of China’s semiconductor industry in the global market. In the mechanical processing industry, diamond-hard-coated cutting tools grown using this equipment can significantly extend tool life and improve machining accuracy, thus driving the mechanical processing industry toward a transformation and upgrade toward greater precision and efficiency.
The hot-filament chemical vapor deposition (HFCVD) equipment promotes green and environmentally friendly practices: In the field of environmental protection, the diamond products grown by this equipment can be applied to wastewater treatment. For instance, diamond electrodes exhibit highly efficient catalytic performance in electrochemical wastewater treatment, enabling them to effectively degrade organic pollutants in wastewater, enhance wastewater treatment efficiency, reduce the use of chemical agents, lower wastewater treatment costs, and thus support the green development of the environmental protection industry. Meanwhile, during operation, the equipment employs advanced energy-saving technologies and eco-friendly designs, reducing energy consumption and pollutant emissions, thereby meeting the social demand for sustainable development.

Plasma-Enhanced Chemical Vapor Deposition (PECVD) Equipment In chemical vapor deposition, an excitation gas is used to generate a low-temperature plasma, thereby enhancing the chemical reactivity of the reactants and enabling epitaxial growth. The primary advantages of plasma-enhanced chemical vapor deposition include low deposition temperatures, minimal impact on the substrate’s structure and physical properties; excellent uniformity in film thickness and composition; dense film microstructure with few pinholes; strong adhesion of the film layer; and a wide range of applications, allowing the preparation of various metal films, inorganic films, and organic films. Pengcheng Semiconductor’s PECVD is the first to introduce a dual-frequency mode: the intermediate frequency increases energy, while the radio frequency boosts flux.

Pengcheng Semiconductor is rooted at the intersection of “technological frontiers, market frontiers, and industrial frontiers,” and is committed to equally emphasizing original innovation and technological breakthroughs. Focusing on industry pain points and bottlenecks in domestic substitution, the company strives to achieve independent control over critical core technologies and to forge a path toward domestically replacing high-end equipment with secure and reliable alternatives. The company specializes in the R&D, design, and full-system manufacturing of micro- and nano-materials (with particular emphasis on semiconductor materials) as well as advanced process technology services and equipment.
The company’s talent team is scientifically and reasonably structured, featuring a high-level materials and process research team composed of university professors and PhDs, deeply integrated with an experienced equipment design team drawn from industry. Together, they boast over 30 years of technical expertise and industry experience in micro- and nano-materials and devices, PVD/CVD deposition, epitaxial growth, and the complete design and engineering delivery of thin-film equipment. Currently, Pengcheng Semiconductor serves a diverse clientele that includes core users in the defense industry, defense research institutes, technology-related listed companies, high-level national key laboratories, and national-level talent teams—including experts under the “Thousand Talents Program,” Yangtze River Scholars, and overseas high-caliber talents.

At this exhibition, Pengcheng Semiconductor not only demonstrated its leading role as an industry innovation benchmark but also contributed “Shenzhen Wisdom” to building an open and collaborative global tech ecosystem, helping China’s semiconductor industry step onto a higher-level international stage of competition.