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The Curtain Falls, Yet the Momentum Persists—Pioneering a Bright Future | Pengcheng Micro-Nano Successfully Concludes the 2026 Second Glass Substrate and Optoelectronic Integration Technology Summit

Release time:

2026-04-30

The two-day “2026 Second Glass Substrate and Optoelectronic Integration Technology Summit—From TGV Process to CPO Integration” has successfully concluded in Dongguan. Pengcheng Micro-Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro-Nano”), a company specializing in semiconductor and broader semiconductor processes and equipment, showcased its core process equipment at Booth A6.

The two-day “2026 Second Glass Substrate and Optoelectronic Integration Technology Summit—From TGV Process to CPO Integration” has successfully concluded in Dongguan. Pengcheng Micro-Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “ Pengcheng Micro-Nano “As a company specializing in semiconductor and broader semiconductor-related processes and equipment, we showcased our core process equipment at Booth A6 and engaged in pragmatic technical exchanges and industry discussions with peers on topics such as glass substrates, TGV processes, and CPO integration.”

Centered on the theme “From TGV Technology to CPO Integration,” this summit focused on key industry topics such as glass substrates and AI computing power interconnectivity.

Pengcheng Micro-Nano is exhibiting the following this time: Production-grade TGV/TSV/TMV high-vacuum magnetron sputtering coating systems, is oriented towards Equipment for developing advanced packaging applications using glass and ceramic substrates. This equipment is specifically designed for plating metal seed layers in high-density through-hole and blind-via applications. Depth-to-diameter ratio > 10:1 It features high film uniformity and repeatability, as well as strong adhesion, providing reliable support for advanced packaging processes such as TGV/TSV and CPO optoelectronic integration.

Production-grade TGV/TSV/TMV high-vacuum magnetron sputtering coating system

During the exhibition, Pengcheng Micro-Nano’s technical team engaged in in-depth discussions with attendees on equipment performance, TGV metallization yield, process compatibility, and production-line stability, carefully listening to users’ practical needs and feedback. These exchanges provided valuable insights and reference data for subsequent product optimization and process refinement.

Currently, glass substrates, as the next-generation chip substrates, are transitioning from the “technology validation” phase to the “eve of mass production.” Pengcheng Micro-Nano will continue to deepen its expertise in core technologies such as magnetron sputtering deposition, steadily advancing product performance improvements and process optimization to meet the application requirements of packaging scenarios like TGV, thereby providing industry customers with stable, reliable, domestically produced equipment and services.

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Dalian, let’s meet—join Pengcheng Micro‑Nano at the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies.

In early summer, in May, a major event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nano‑Electronics Technology, will be grandly held in Dalian, a coastal city. Pengcheng Micro‑Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro‑Nano”) will attend this conference, joining industry experts, scholars, and upstream and downstream partners to explore new opportunities in micro‑ and nano‑devices, advanced packaging, and the localization of semiconductor equipment.

High-Energy Pulsed Magnetron Sputtering Coating: The Indigenous Key to the Nanoscale World of Semiconductors

The core chips in the smartphones, computers, and 5G devices we use every day harbor a “nanoscale world” that is less than one ten-thousandth the diameter of a human hair—the realm of advanced-node semiconductors. The insulating layers, barrier layers, and conductive films within these chips must all be “grown” with nanometer-level precision—this is precisely where high-power impulse magnetron sputtering (HiPIMS) coating technology comes into play.

The Curtain Falls, Yet the Momentum Persists—Pioneering a Bright Future | Pengcheng Micro-Nano Successfully Concludes the 2026 Second Glass Substrate and Optoelectronic Integration Technology Summit

Pengcheng Micro-Nano will be exhibiting at the “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration.”

The “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration” will be held from April 27 to April 28 at the Emperor Hotel in Songshan Lake, Dongguan.

“The Coating Black Technology” Hidden in Medical Imaging

When it comes to medical imaging, most people are familiar with procedures such as CT and PET-CT scans. During operation, the performance of these devices—particularly the clarity and sensitivity of the resulting images—is largely determined by a nanoscale precision thin film coating on their core components. This critical coating is made possible by an unsung “coating black technology”: magnetron sputtering.

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