Application of Magnetron Sputtering Technology in the Preparation of Core Thin Films for Key Components in Medical Imaging

In the ongoing evolution of modern medical imaging technology, magnetron sputtering has become a core process in the field of thin-film fabrication and is widely used in the manufacturing of critical components for medical imaging.

Principles, Classification, and Applications of Physical Vapor Deposition (PVD) Technology

Physical Vapor Deposition (PVD) is an advanced surface engineering technology that, under vacuum conditions, uses physical methods to convert a target material into gaseous atoms, molecules, or ions, which then deposit onto the substrate surface to form a thin film. Since its development in the early 20th century, PVD technology has become an important technique in modern additive manufacturing and functional coating applications, owing to its advantages such as environmental friendliness, controllable costs, minimal consumable usage, dense and uniform film properties, and strong adhesion between the film and substrate. PVD can be used on demand to fabricate functional thin films with properties including wear resistance, corrosion resistance, electrical conductivity, insulation, piezoelectricity, and magnetism, and is widely applied across various industries, including mechanical, electronic, construction, and medical sectors.

The TGV glass through-hole technology has achieved a significant breakthrough, and its application prospects continue to expand.

Recently, TGV (Through Glass Via) technology has made significant progress in the fields of materials processing and micro- and nano-manufacturing, drawing considerable attention from the semiconductor, advanced packaging, and emerging electronic device industries. With its outstanding electrical performance, high-frequency characteristics, and three-dimensional integration capabilities, TGV is emerging as one of the key technologies for next-generation high-density interconnects.

Diamond: Possessing potential that surpasses existing semiconductor materials, with an even broader range of future applications.

Diamond is used as a semiconductor material—and some scholars even hail it as the “ultimate semiconductor material” and the “ultimate room-temperature quantum material”—owing to its unique physical and chemical properties. Diamond is an ultra-wide-bandgap semiconductor that boasts exceptional electrical, optical, mechanical, thermal, and chemical characteristics. These properties give diamond broad application prospects in numerous fields.

Pengcheng Semiconductor: The Strategy, Tactics, and Survival Guide for a High-Tech Enterprise

The 15th China International Nanotechnology Industry Expo (referred to as "Nanoexpo") has successfully concluded amid widespread anticipation. This year's event featured one keynote speech, 15 parallel forums, and a total of 605 cutting-edge presentations. It also included an innovation and entrepreneurship competition and three supply-demand matchmaking sessions. The expo brought together over 150 national-level talents and more than 500 top experts from universities, research institutes, and enterprises both at home and abroad. With an exhibition area of 25,000 square meters, the event attracted over 350 leading global companies and institutions, showcasing more than 2,400 of the latest technological products and innovative applications in the global nanotechnology field. Over the three-day period, the total number of attendees reached nearly 27,500, making this year’s expo the largest in its history and elevating its influence to new heights.

Pengcheng Semiconductor Debuts at the High-End Professional Exhibition “Optoelectronics + Semiconductors”—Shenzhen’s 26th China International Optoelectronic Exposition

When the “speed of light” innovation in optoelectronics meets the “precision” breakthroughs in semiconductors, two premier, high-end specialized exhibitions—leading global industrial collaboration—are making a cross-sector debut and shining brightly in Shenzhen. On September 10, the 26th China International Optoelectronic Expo (CIOE) and SEMI-e Shenzhen International Semiconductor Exhibition, together with the 2025 Integrated Circuit Industry Innovation Expo, made their debut at the Shenzhen International Convention and Exhibition Center. With an exhibition area exceeding 300,000 square meters, bringing together more than 5,000 exhibitors and expected to attract 160,000 professional visitors, these events have set a new benchmark for collaborative development in the optoelectronics + semiconductor industry, injecting powerful momentum into the global tech sector as it breaks through technological barriers and ignites innovative drive.

Pengcheng Semiconductor Hard Coating Film Solutions: Empowering High-End Manufacturing Performance

In the arena of high-end manufacturing, every technological breakthrough is like a shining new star, illuminating the path forward for the industry. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”), as an innovation leader in the industry, is injecting powerful momentum into the enhancement of high-end manufacturing performance with its outstanding hard-coating deposition solutions, and has become a trusted partner for numerous enterprises.

Exhibition Invitation | Pengcheng Semiconductor cordially invites you to attend the 2025 China Materials Conference!

The “China Materials Conference 2025” will be held from July 5 to 8, 2025, at the Xiamen International Convention & Exhibition Center in Fujian Province. The conference is expected to attract 30,000 participants and will feature 115 domestic and international sub-conferences covering five major thematic areas: energy materials, environmental materials, advanced structural materials, functional materials, and materials design, preparation, and evaluation. In addition, a series of specialized forums will be organized, including a Youth Forum, a Special New Materials Forum, a Materials Education Forum, and a Materials Journals Forum. Furthermore, an International Exhibition of New Materials Research Instruments and Equipment will be held concurrently.

Pengcheng Semiconductor Debuts, Focusing on “Bottleneck” and “Cutting-Edge, High-Stakes” Fields—2025 China Materials Conference

“China Materials Conference 2025”: As a nationally recognized, high-level academic conference in the field of new materials, this event is geared toward addressing major national needs. It brings together the most authoritative experts and scholars as well as top-tier, nationally strategic scientific and technological forces. Focusing on critical breakthroughs in areas where we face “bottleneck” challenges and in “frontier fields that are fiercely contested,” the conference promotes high-end academic discussions, tackles significant common issues in industry development, and resolves major challenges in the advancement of emerging industries. By seizing the global academic leadership in new materials development, it will help establish a systematic, nation-wide strategic framework, laying a solid material foundation and providing robust safeguards for advancing the construction of China’s new-quality productive forces.

The global MBE market is steadily growing, and China’s Pengcheng Semiconductor has broken through the technological monopoly.

In 2021, the global market size for molecular beam epitaxy (MBE) systems was approximately RMB 550 million. Looking ahead to 2028, this figure is expected to climb to RMB 960 million, implying that the market will continue to grow at a compound annual growth rate of 8.3% between 2022 and 2028. Molecular beam epitaxy systems play a critical role in semiconductor and fundamental materials research. The major consumers of these systems are industrialized countries with well-developed manufacturing sectors, including Europe, the United States, Japan, and China—collectively accounting for over 80% of the global market share.