Pengcheng Semiconductor showcases TGV/TSV/TMV technologies at the Shanghai Photonics Expo in Munich.

The Munich Shanghai Photonics Expo is widely regarded as the annual highlight of the laser, optics, and optoelectronics industries in Asia. Since its inaugural edition held in Shanghai in 2006, the event has steadily grown in scale and influence, emerging as a key global platform for exchange within the optoelectronics sector. The Munich Shanghai Photonics Expo will be held from March 20 to 22, 2025, at the Shanghai New International Expo Center (No. 2345 Longyang Road, Pudong New Area, Shanghai). At that time, Pengcheng Semiconductor will showcase its cutting-edge thin-film deposition equipment and technology solutions at Booth 4631 in Hall E4. Our products are based on PVD and CVD technologies, which leverage nanoscale and atomic-level manufacturing techniques to produce high-quality thin films. For example, we employ magnetron sputtering for the preparation of single-crystal thin films and utilize magnetron sputtering as a beam source for molecular-beam epitaxy. The exhibits cover popular application areas such as micro- and nano-optics, acoustics, and medical technologies. This year’s Munich Shanghai Photonics Expo will present you with the latest technologies and products. We cordially invite both new and existing customers to visit our booth and engage in discussions and exchanges!

Pengcheng Semiconductor’s TGV technology for glass substrates is boosting advanced packaging.

In the field of advanced packaging, whether it’s the interposer used in 2.5D packaging or the through-silicon vias (TSVs) employed in 3D packaging, TSVs have long been a key component. However, recently, many people have started hearing about a new term: Through Glass Vias (TGV). With its enormous potential, Through Glass Vias (TGV) could become a staple in advanced packaging technologies in the future. This article provides a brief overview of the applications and development trends of Through Glass Vias (TGV) in advanced packaging, as well as an introduction to the associated manufacturing processes.

Production-oriented TGV/TSV/TMV

The production-type TGV/TSV high-vacuum magnetron sputtering coating system is designed for coating high-density through-holes and blind holes on glass substrates and ceramic substrates, with aspect ratios exceeding 10:1. For example, this equipment is used in the substrate coating process to deposit Cu/Ti microstructures and Au/TiW dual-layer films for transmission lines, thereby supporting the enhancement of integration density in microsystems.

Great News! We warmly congratulate Pengcheng Semiconductor on receiving the National Invention Patent Certificate.

We warmly congratulate Pengcheng Semiconductor on the authorization of its invention patent, “A Plug-in Valve and a Vertical Dual-Chamber Hot-Wire CVD System,” by the National Intellectual Property Administration, and on receiving the National Invention Patent Certificate on December 10, 2024.

Principle of Vacuum Coating Equipment

A vacuum coating machine is an advanced surface treatment technology device that can deposit one or more thin films onto the surfaces of various materials, endowing the substrate with new properties such as enhanced wear resistance, corrosion resistance, and improved optical performance. The operating principle of a vacuum coating machine is primarily based on Physical Vapor Deposition (PVD) technology, which involves a variety of physical processes including vacuum technology, thermal evaporation, and sputtering.

The National Third-Generation Semiconductor Conference Opens in Suzhou Nano City.

On October 22, 2024, the 2024 National Third-Generation Semiconductor Conference, hosted by Today Semiconductor, was grandly opened in Suzhou Nano City. The conference drew numerous industry elites and corporate representatives, creating a vibrant and unprecedentedly enthusiastic atmosphere. As an industry leader, Pengcheng Semiconductor showcased its PVD coating equipment, HFCVD hot-filament chemical vapor deposition equipment, molecular beam epitaxy (MBE) systems, plasma-enhanced chemical vapor deposition (PECVD) equipment, and related solutions at this conference, attracting the attention of industry professionals and experts from across the country and becoming one of the event’s major highlights.

Pengcheng Semiconductor Debuts at the 5th China New Materials Industry Development Conference in Wuhan

In Wuhan during the golden autumn month of October, a grand event bringing together top expertise from across China and around the globe in the field of new materials—the 5th China New Materials Industry Development Conference—is about to kick off. The conference will be held from October 16 to 18, 2024, at the China Car Valley International Sports and Cultural Exchange Center in the Economic Development Zone of Wuhan, Hubei Province. Organized by the Chinese Society for Materials Research, the conference has attracted numerous leading figures from the new materials industry. Among them, Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (referred to as “Pengcheng Semiconductor”), a prominent player in the industry, will make an appearance at the conference to showcase its latest achievements and technological innovations in the semiconductor sector.

Features and Functional Advantages of Plasma Coating Equipment

A plasma coating system is a surface treatment equipment with a wide range of applications and significant functional advantages. It is primarily used for surface coating and modification. By exposing materials to a plasma environment, this technology leverages ion bombardment and reactive deposition mechanisms to modify and coat material surfaces. This technology finds extensive applications across various industries, including electronics, optoelectronics, medical devices, automotive, and others.

Applications and Precautions for Magnetron Sputtering Coating Equipment

The magnetron sputtering coating system (PVD coating equipment) is a commonly used surface-coating device. It employs evaporation or sputtering under vacuum conditions to deposit thin films onto substrate surfaces, enabling the preparation of metal, alloy, compound, semiconductor, ceramic, dielectric composite films, and other chemically reactive films. This technique is suitable for depositing various single-layer films, multilayer films, doped films, and alloy films, and can be used to coat both magnetic and non-magnetic materials. It finds extensive applications in industries such as electronics, optoelectronics, optics, and medical devices. To ensure proper operation and achieve excellent coating results, the following are some key details and tips to keep in mind when using a magnetron sputtering coating system.

Hot Filament Chemical Vapor Deposition (HFCVD) Diamond Coating Equipment Manufacturer — Earthquake Information

As a semiconductor material with an ultra-wide bandgap, diamond boasts exceptional physical properties, including high carrier mobility, high thermal conductivity, high breakdown electric field, high carrier saturation velocity, and low dielectric constant. It is widely regarded as the “ultimate semiconductor” for fabricating next-generation electronic devices that feature high power, high frequency, high temperature resistance, and low power loss.