Hot Filament Chemical Vapor Deposition (HFCVD) Diamond Coating Equipment Manufacturer — Earthquake Information
Release time:
2024-07-22
As a semiconductor material with an ultra-wide bandgap, diamond boasts exceptional physical properties, including high carrier mobility, high thermal conductivity, high breakdown electric field, high carrier saturation velocity, and low dielectric constant. It is widely regarded as the “ultimate semiconductor” for fabricating next-generation electronic devices that feature high power, high frequency, high temperature resistance, and low power loss.
Compared with advanced countries, China’s diamond semiconductor industry faces the following challenges: 1. Key equipment relies on imports, lacking independent intellectual property rights and thus vulnerable to foreign embargoes; 2. There is a shortage of technologies for preparing large-size diamond substrates and for epitaxial growth of diamond films; 3. Technologies for diamond grinding, bonding, and thinning remain immature, creating significant gaps. This project brings together top research teams from universities and outstanding engineering teams from industry, seamlessly integrating R&D and production processes—including high-quality diamond film growth, custom design of HFCVD and hot-filament CVD diamond deposition equipment, and wafer polishing, bonding, and thinning—necessary for industrialization. Starting with tool-grade and thermal-grade products, we will continue to drive forward the development of optical-grade, electronic-grade, and even quantum-grade products.
Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (abbreviated as Pengcheng Semiconductor) has independently developed an HFCVD hot-filament chemical vapor deposition (HFCVD) equipment—specifically, a hot-filament chemical vapor deposition (HFCVD) diamond-coating system—that can be used for the production of micrometer- and nanocrystalline diamond wafers. It is also capable of fabricating corrosion-resistant and wear-resistant hard coatings, diamond BDD electrodes, and thin-film solar cells, among other applications.
The domestically developed and manufactured single- or double-sided coated hot-filament CVD diamond equipment (HFCVD) can produce polycrystalline diamond wafers with substrate sizes of 2 inches, 4 inches, 6 inches, and 8 inches.
Diamond Film Production Line
6-inch diamond heat-dissipating wafer
Application fields: third-generation semiconductors, high-power lasers, 10G communications, micro- and nano-acoustics, power amplifier devices, filtering devices, and more. The technology can be applied to the R&D and production of diamond products at the mechanical, thermal, optical, and acoustic levels.
Company Profile:
Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. was co-founded by Harbin Institute of Technology (Shenzhen) and a team of engineers with many years of practical experience. The company is rooted at the intersection of market frontiers, industrial frontiers, and technological frontiers, striving for innovation-led growth and sustainable development. It aims to address industry pain points and challenges in domestic substitution, and to achieve independent and controllable supply chains.
The company’s core business encompasses the R&D, design, and manufacturing of micro- and nano-materials (including semiconductor materials), micro- and nano-manufacturing processes, and micro- and nano-equipment.
Research-oriented equipment: PVD, CVD, MBE molecular beam epitaxy, and others.
Industrial production equipment: large-scale vapor deposition equipment, multi-arc ion-source coating equipment, rectangular magnetron sputtering coating equipment, electron-beam evaporation equipment, OLED coating equipment, HFCVD hot-filament chemical vapor deposition equipment, vacuum high-temperature CVD furnace, and six-inch MBE production equipment.
The company’s technologies and products can be widely applied in the following fields: new materials, new energy, microelectronics and optoelectronics, semiconductors, acoustics, optics, microelectromechanical systems (MEMS); sensors, biomedicine, precision medicine, greater healthcare, environmental protection, micro- and nano-robotics, and surface technology.
The company’s core R&D team boasts a well-rounded knowledge structure, featuring a high-level team of materials and process researchers centered around professors and doctoral researchers from Harbin Institute of Technology, as well as a team of senior equipment designers from industry. The company’s team has over 20 years of experience in the research of micro- and nano-materials and devices (including semiconductor materials), PVD/CVD deposition technologies, epitaxial growth technologies, and the design, production, and manufacturing of complete sets of thin-film preparation equipment.
News Center
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Contact: Ms. Dai
Shenyang Office Address: No. 15, Wanghua South Street, Dadong District, Shenyang City, Liaoning Province
Shenzhen Headquarters Address: Building 1, Chongwen Park, Nanshan Zhiyuan, No. 3370 Liuxian Avenue, Nanshan District, Shenzhen City, Guangdong Province
Phone:+86-13632750017
Email:sales@hitnano-sy.com
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