Pengcheng Semiconductor’s TGV technology for glass substrates is boosting advanced packaging.
Release time:
2025-02-17
In the field of advanced packaging, whether it’s the interposer used in 2.5D packaging or the TSVs employed in 3D packaging, recently many people have been hearing about a term called “Through Glass Via (TGV).” Through-Glass Vias (TGV) With enormous potential, TGV (Through-Glass Vias) is likely to become a frequent feature in advanced packaging technologies in the future. This article provides a brief overview of the applications and development trends of TGV in advanced packaging, as well as an introduction to its manufacturing processes.
Glass substrates are next-generation chip substrates whose core material is made of glass. The key technology for glass substrate packaging is TGV (Through Glass Via). The glass substrate industry chain encompasses various links, including manufacturing, raw materials, equipment, technology, packaging, testing, and applications. The upstream segment comprises manufacturing, raw materials, and equipment. Due to their unique physicochemical properties, glass substrates demonstrate tremendous potential in the field of electronic component materials.
The global IC packaging substrate market is experiencing rapid growth, with an estimated size of US$31.54 billion by 2029. Glass substrates represent the latest trend, and their penetration rate is expected to exceed 50% within the next five years. The global glass substrate market boasts vast potential, projected to expand to US$11.3 billion by 2031. China’s glass substrate market continues to grow steadily, reaching RMB 33.3 billion in 2023. Domestic manufacturers enjoy significant cost advantages, accelerating the localization of glass substrates and creating enormous market opportunities.
Through-Glass Via (TGV) interconnect technology can be traced back as early as 2008. It evolved from the 2.5D/3D integrated TSV interposer technology and is primarily designed to address issues such as degraded high-frequency or high-speed signal transmission performance caused by silicon substrate loss, high material costs, and complex manufacturing processes associated with conventional TSV interposers. In recent years, this technology has continued to mature and improve. Leading companies have begun to deploy it and have produced several prototypes for use in various fields, including sensors, CPUs, GPUs, AI applications, display panels, medical devices, and advanced semiconductor packaging.
The advantages of Through-Glass Vias (TGV) primarily lie in:
1) Excellent high-frequency electrical characteristics.
2) Large-size, ultra-thin glass substrates are readily available.
3) Low cost. Thanks to the easy availability of large-size, ultra-thin panel glass and the elimination of the need to deposit an insulating layer, the manufacturing cost of glass-based interconnect substrates is approximately only one-eighth that of silicon-based interconnect substrates.
4) The process flow is simple. There is no need to deposit an insulating layer on the substrate surface or on the inner walls of the TGV, and there is no need to thin the ultra-thin interposer.
5) Strong mechanical stability. Even when the adapter board thickness is less than 100 µm, warping remains minimal.
6) With a wide range of application fields, this is an emerging vertical interconnection technology used in wafer-level packaging. It provides a novel technological approach for achieving the shortest possible distance and smallest pitch between chips, offering excellent electrical, thermal, and mechanical performance. This technology holds unique advantages in areas such as RF chips, high-end MEMS sensors, and high-density system integration, making it one of the top choices for 3D packaging of next-generation 5G and 6G high-frequency chips.
Equipment manufacturer - Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd.
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