In early summer, in May, a major event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nano‑Electronics Technology, will be grandly held in Dalian, a coastal city. Pengcheng Micro‑Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro‑Nano”) will attend this conference, joining industry experts, scholars, and upstream and downstream partners to explore new opportunities in micro‑ and nano‑devices, advanced packaging, and the localization of semiconductor equipment.
2026/05/16
The core chips in the smartphones, computers, and 5G devices we use every day harbor a “nanoscale world” that is less than one ten-thousandth the diameter of a human hair—the realm of advanced-node semiconductors. The insulating layers, barrier layers, and conductive films within these chips must all be “grown” with nanometer-level precision—this is precisely where high-power impulse magnetron sputtering (HiPIMS) coating technology comes into play.
2026/05/09
The two-day “2026 Second Glass Substrate and Optoelectronic Integration Technology Summit—From TGV Process to CPO Integration” has successfully concluded in Dongguan. Pengcheng Micro-Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro-Nano”), a company specializing in semiconductor and broader semiconductor processes and equipment, showcased its core process equipment at Booth A6.
2026/04/30
The “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration” will be held from April 27 to April 28 at the Emperor Hotel in Songshan Lake, Dongguan.
2026/04/24
“The Coating Black Technology” Hidden in Medical Imaging
When it comes to medical imaging, most people are familiar with procedures such as CT and PET-CT scans. During operation, the performance of these devices—particularly the clarity and sensitivity of the resulting images—is largely determined by a nanoscale precision thin film coating on their core components. This critical coating is made possible by an unsung “coating black technology”: magnetron sputtering.
2026/04/08
In the ongoing evolution of modern medical imaging technology, magnetron sputtering has become a core process in the field of thin-film fabrication and is widely used in the manufacturing of critical components for medical imaging.
2026/01/29
Principles, Classification, and Applications of Physical Vapor Deposition (PVD) Technology
Physical Vapor Deposition (PVD) is an advanced surface engineering technology that, under vacuum conditions, uses physical methods to convert a target material into gaseous atoms, molecules, or ions, which then deposit onto the substrate surface to form a thin film. Since its development in the early 20th century, PVD technology has become an important technique in modern additive manufacturing and functional coating applications, owing to its advantages such as environmental friendliness, controllable costs, minimal consumable usage, dense and uniform film properties, and strong adhesion between the film and substrate. PVD can be used on demand to fabricate functional thin films with properties including wear resistance, corrosion resistance, electrical conductivity, insulation, piezoelectricity, and magnetism, and is widely applied across various industries, including mechanical, electronic, construction, and medical sectors.
2026/01/13
Recently, TGV (Through Glass Via) technology has made significant progress in the fields of materials processing and micro- and nano-manufacturing, drawing considerable attention from the semiconductor, advanced packaging, and emerging electronic device industries. With its outstanding electrical performance, high-frequency characteristics, and three-dimensional integration capabilities, TGV is emerging as one of the key technologies for next-generation high-density interconnects.
2026/01/05
Diamond is used as a semiconductor material—and some scholars even hail it as the “ultimate semiconductor material” and the “ultimate room-temperature quantum material”—owing to its unique physical and chemical properties. Diamond is an ultra-wide-bandgap semiconductor that boasts exceptional electrical, optical, mechanical, thermal, and chemical characteristics. These properties give diamond broad application prospects in numerous fields.
2025/12/16
Pengcheng Semiconductor: The Strategy, Tactics, and Survival Guide for a High-Tech Enterprise
The 15th China International Nanotechnology Industry Expo (referred to as "Nanoexpo") has successfully concluded amid widespread anticipation. This year's event featured one keynote speech, 15 parallel forums, and a total of 605 cutting-edge presentations. It also included an innovation and entrepreneurship competition and three supply-demand matchmaking sessions. The expo brought together over 150 national-level talents and more than 500 top experts from universities, research institutes, and enterprises both at home and abroad. With an exhibition area of 25,000 square meters, the event attracted over 350 leading global companies and institutions, showcasing more than 2,400 of the latest technological products and innovative applications in the global nanotechnology field. Over the three-day period, the total number of attendees reached nearly 27,500, making this year’s expo the largest in its history and elevating its influence to new heights.
2025/11/11
Contact: Ms. Dai
Shenyang Office Address: No. 15, Wanghua South Street, Dadong District, Shenyang City, Liaoning Province
Shenzhen Headquarters Address: Building 1, Chongwen Park, Nanshan Zhiyuan, No. 3370 Liuxian Avenue, Nanshan District, Shenzhen City, Guangdong Province
Phone:+86-13632750017
Email:sales@hitnano-sy.com
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