NEWS

Pengcheng Semiconductor Debuts, Focusing on “Bottleneck” and “Cutting-Edge, High-Stakes” Fields—2025 China Materials Conference

Release time:

2025-06-24

“China Materials Conference 2025”: As a nationally recognized, high-level academic conference in the field of new materials, this event is geared toward addressing major national needs. It brings together the most authoritative experts and scholars as well as top-tier, nationally strategic scientific and technological forces. Focusing on critical breakthroughs in areas where we face “bottleneck” challenges and in “frontier fields that are fiercely contested,” the conference promotes high-end academic discussions, tackles significant common issues in industry development, and resolves major challenges in the advancement of emerging industries. By seizing the global academic leadership in new materials development, it will help establish a systematic, nation-wide strategic framework, laying a solid material foundation and providing robust safeguards for advancing the construction of China’s new-quality productive forces.

“China Materials Conference 2025”: As a nationally recognized, high-level academic conference in the field of new materials, this event is geared toward addressing major national needs. It brings together the most authoritative experts and scholars as well as top-tier, nationally strategic scientific and technological forces. Focusing on critical breakthroughs in “bottleneck” areas and “frontier areas of intense competition,” the conference promotes high-end academic discussions, tackles significant common challenges in industry development, and resolves major difficulties encountered in the advancement of emerging industries. By seizing the global academic leadership in new materials development, it will help establish a systematic, nation-wide strategic framework, laying a solid material foundation and providing robust safeguards for advancing the construction of China’s new-quality productive forces.
The “China Materials Conference 2025” will be held from July 5 to 8 at the Xiamen International Convention & Exhibition Center in Fujian Province.

At that time, Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “ Pengcheng Semiconductor ”) will showcase cutting-edge thin-film deposition equipment and technology solutions at booth C3094. Based on nano- and atomic-scale manufacturing, PVD/CVD Technology for high-quality thin-film preparation. For example, using... Magnetron sputtering The technology involves preparing single-crystal thin films, with magnetron sputtering being employed. Molecular Beam Epitaxy beam sources, etc.

Vacuum coating technology is widely used in various fields, including electronics, optical instruments, medical devices, new energy, lighting, automotive, mechanical equipment, and aerospace. For example, in the electronics industry, vacuum coating technology is employed to fabricate semiconductor devices, microelectronic components, reflective surfaces, insulating protective coatings, and high-temperature sensors. Moreover, vacuum coating technology can enhance the physical properties, chemical properties, and service life of substrates while generating minimal environmental pollution.
Pengcheng Semiconductor primarily focuses on product enhancement, optimization and iterative improvements, raising the technological bar, deeply exploring user needs, and addressing the industry’s most challenging pain points. We categorize products based on their underlying principles and methodologies to ensure comprehensive coverage. PVD: Physical Vapor Deposition 、 CVD chemical vapor deposition 、 Molecular Beam Epitaxy Thin-Film Growth Equipment MBE 。
Pengcheng Semiconductor adopts a dual-drive model in which process technology and equipment iterate and mutually reinforce each other. This enables the materials produced by the equipment to be optimized to even higher levels, thereby enhancing competitiveness. More specifically: (1) We have advanced magnetron sputtering technology to ultra-high vacuum levels, and under super-clean conditions, we employ PVD technology to epitaxially grow single-crystal gallium nitride. (2) This includes, but is not limited to, addressing... Hot-wire CVD When there are many hot filaments, the filaments tend to stick together, which can lead to filament breakage during prolonged use. To address this issue, we have developed a growth process for large-size polycrystalline diamond wafers.
In short, Pengcheng Semiconductor will showcase its latest breakthroughs in the fields of “bottleneck technologies” and “cutting-edge, must-win areas” at the China Materials Conference 2025. We look forward to engaging in exchanges and collaborating with colleagues from across the industry to jointly drive the sustained development of the semiconductor sector.

Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine

News Center

Dalian, let’s meet—join Pengcheng Micro‑Nano at the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies.

In early summer, in May, a major event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nano‑Electronics Technology, will be grandly held in Dalian, a coastal city. Pengcheng Micro‑Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro‑Nano”) will attend this conference, joining industry experts, scholars, and upstream and downstream partners to explore new opportunities in micro‑ and nano‑devices, advanced packaging, and the localization of semiconductor equipment.

High-Energy Pulsed Magnetron Sputtering Coating: The Indigenous Key to the Nanoscale World of Semiconductors

The core chips in the smartphones, computers, and 5G devices we use every day harbor a “nanoscale world” that is less than one ten-thousandth the diameter of a human hair—the realm of advanced-node semiconductors. The insulating layers, barrier layers, and conductive films within these chips must all be “grown” with nanometer-level precision—this is precisely where high-power impulse magnetron sputtering (HiPIMS) coating technology comes into play.

The Curtain Falls, Yet the Momentum Persists—Pioneering a Bright Future | Pengcheng Micro-Nano Successfully Concludes the 2026 Second Glass Substrate and Optoelectronic Integration Technology Summit

The two-day “2026 Second Glass Substrate and Optoelectronic Integration Technology Summit—From TGV Process to CPO Integration” has successfully concluded in Dongguan. Pengcheng Micro-Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro-Nano”), a company specializing in semiconductor and broader semiconductor processes and equipment, showcased its core process equipment at Booth A6.

Pengcheng Micro-Nano will be exhibiting at the “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration.”

The “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration” will be held from April 27 to April 28 at the Emperor Hotel in Songshan Lake, Dongguan.

“The Coating Black Technology” Hidden in Medical Imaging

When it comes to medical imaging, most people are familiar with procedures such as CT and PET-CT scans. During operation, the performance of these devices—particularly the clarity and sensitivity of the resulting images—is largely determined by a nanoscale precision thin film coating on their core components. This critical coating is made possible by an unsung “coating black technology”: magnetron sputtering.

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