Exhibition Invitation | Pengcheng Semiconductor cordially invites you to the 7th Global Semiconductor Industry (Chongqing) Expo.

The 7th Global Semiconductor Industry (Chongqing) Expo will be held from May 8 to 10, 2025, at the Chongqing International Expo Center. With the theme “New Era—Creating a Chip-Fueled Future,” the expo will feature an exhibition area of 40,000 square meters, attract 800 participating companies, and draw 35,000 professional visitors for networking and exchange.

At that time, Pengcheng Semiconductor will showcase its cutting-edge thin-film deposition equipment and technology solutions at Hall S1, Booth A131. Leveraging PVD and CVD technologies based on nano- and atomic-scale manufacturing, our solutions enable the preparation of high-quality thin films. For example, we employ magnetron sputtering to fabricate single-crystal thin films and utilize magnetron sputtering as a beam source for molecular-beam epitaxy. Our exhibits cover popular application areas such as micro- and nano-optics, acoustics, and medical devices. This 7th Global Semiconductor Industry (Chongqing) Expo will bring you a glimpse of the latest technologies and products. We cordially invite both new and existing customers to visit our booth and engage in discussions and exchanges!

Company Introduction

Pengcheng Semiconductor Technology ( Shenzhen ) Limited Liability Company, by Harbin Institute of Technology ( Shenzhen ) Founded in collaboration with a team of engineers who have years of practical experience, the company is rooted at the intersection of technological and market frontiers, striving for innovation-led growth and sustainable development. We aim to address industry pain points and challenges related to domestic substitution, and to achieve independent control over the industrial chain.

Pengcheng Micro- and Nano-Technology (Shenyang) Co., Ltd. is a wholly-owned subsidiary of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd., and serves as both a design center and a manufacturing base for semiconductor processes and equipment.

The company’s core business is micro- and nano-technology and high-end precision manufacturing. Specific application areas include the R&D and design, production and manufacturing, process technology services, and upgrade and retrofit of semiconductor equipment, as well as the development and prototyping of semiconductor processes. We can provide customers with process R&D and sample fabrication services.

The company’s talent team boasts a comprehensive knowledge structure, featuring a high-level materials and process research team centered on professors and doctoral researchers from Harbin Institute of Technology. Additionally, the team includes a group of senior equipment designers from industry who possess... 20 Years of experience in semiconductor material research, epitaxial technology research, and the design, production, and manufacturing of complete sets of equipment for preparing semiconductor thin films.

The company is affiliated with Harbin Institute of Technology. ( Shenzhen ) Equipped with advanced semiconductor R&D equipment platforms and testing equipment platforms, the company is able to conduct research and development work from a high starting point. Headquartered in Shenzhen, the company has capabilities in the R&D, production, and commissioning of semiconductor equipment, as well as in the pilot-scale production, manufacturing, and sales of semiconductor materials and devices.

Product Introduction

1 Production-oriented TGV/TSV/TMV High-vacuum magnetron sputtering coating machine

Production-oriented TGV/TSV/TMV High-Vacuum Magnetron Sputtering Coating System (Sputter-2000W Series): This equipment is designed for coating high-density through-holes and blind holes on glass and ceramic substrates, with aspect ratios exceeding 10:1. For example, it is used in substrate coating processes to deposit Cu/Ti microstructures and Au/TiW dual-layer films for transmission lines, thereby supporting the enhancement of integration density in microsystems. Key advantages of this equipment include: highly uniform and reproducible film deposition, strong film adhesion, and programmable, automated control tailored to specific process recipes.

2 Production-grade high-vacuum magnetron sputtering / Ion-assisted / Multi-arc composite coating machine

High-vacuum magnetron sputtering for production / Ion-assisted / Multi-arc composite coating machine PVD-1000S (Series) This equipment is widely used for preparing hard, wear-resistant coatings on surfaces of milling cutters, drill bits, bearings, gears, lenses, and other components. It integrates a variety of process techniques, including workpiece surface treatment, ion cleaning, particulate matter control, magnetron sputtering, ion-assisted deposition, and reactive sputter coating. PVD Equipment.

3. HFCVD Diamond Film Preparation Equipment

Developed, designed, and manufactured the hot filament. CVD Diamond equipment is categorized into two types: experimental equipment and production equipment. This equipment is primarily used for the research and development and production of micrometer- and nanometer-sized diamond films. It can be applied to the R&D and production of diamond products across various technical levels, including mechanical, thermal, optical, and acoustic. The equipment can fabricate large-size polycrystalline diamond wafers, which serve as heat sinks for high-power devices, high-frequency components, and high-power lasers. It is also suitable for producing corrosion-resistant and wear-resistant hard coatings, as well as diamond-based products for wastewater treatment in environmental protection applications. This equipment can be used not only for preparing diamond films on planar workpieces but also for depositing diamond hard coatings on tool surfaces or other irregular surfaces. Furthermore, it can be utilized in the research and development and production of thin-film solar cells.

4. High-vacuum magnetron sputtering system

Research-oriented high-vacuum magnetron sputtering coating machine Circular Sputtering This series is our company’s high-vacuum magnetron sputtering system for scientific research. It primarily employs a circular magnetron sputtering target to deposit metal, alloy, compound, semiconductor, ceramic, dielectric composite films, and other chemically reactive films. It is suitable for coating various single-layer films, multi-layer films, doped films, and alloy films, and can be used to coat both magnetic and non-magnetic materials. It can be applied to: TGV/TSV/TMV R&D of advanced packaging, high aspect ratio ( ≥10:1 Deep-hole seed layer coating.

5 Molecular Beam Epitaxy Thin-Film Growth Equipment MBE )

Molecular Beam Epitaxy Thin-Film Growth Equipment MBE ) It can enable epitaxial growth on certain substrates, enabling the fabrication of molecular self-assembled structures, superlattices, quantum wells, and one-dimensional nanowires. It also allows for process verification of second-generation and third-generation semiconductors as well as the growth and fabrication of epitaxial wafers. The molecular beam epitaxy (MBE) thin-film growth equipment provides an ultra-high vacuum environment during thin-film epitaxial growth, ensuring that the growth process takes place under ideal conditions. This eliminates various interfering factors during film growth, resulting in high-precision thin films with exceptional accuracy.

The molecular beam epitaxy thin-film growth experimental equipment designed and manufactured by our company comes in two types: experimental and production models. These models feature a reasonable configuration, a simple structure, convenient operation, advanced technology, reliable performance, versatile applications, strong practicality, and relatively low prices. They are suitable for use in university laboratories and research institutions as teaching experiments, scientific research tools, and process development platforms in the field of molecular beam epitaxy. Production model MBE Can be used for the preparation of batch epitaxial wafers.

6. PECVD: Plasma-Enhanced Chemical Vapor Deposition

Plasma-enhanced chemical vapor deposition Plasma-enhanced chemical vapor deposition equipment is primarily used for the growth of silicon nitride and silicon oxide thin films in a clean, vacuum environment. Utilizing either single-frequency or dual-frequency plasma-enhanced chemical vapor deposition technology, this equipment represents an ideal process for depositing high-quality thin films of silicon nitride, silicon oxide, and other materials.

7. Production-grade high-vacuum magnetron sputtering and ion-assisted composite coating machine

Production-type high-vacuum magnetron sputtering and ion-assisted composite coating machine (PVD-1000B series): This equipment employs magnetron sputtering, ion assistance, and reactive sputtering processes to deposit various thin-film materials onto the surface of workpieces. It is a PVD device that integrates multiple process technologies, including workpiece surface treatment, ion cleaning, particulate matter control, magnetron sputtering, ion-assisted coating, and reactive sputtering coating.

The 7th Global Semiconductor Industry (Chongqing) Expo

Time: May 8-10, 2025

Location: Chongqing International Expo Center     

Topic: A New Era—Creating a “Chip”-Based Future

Booth Number: Hall S1 - A131