Semiconductor manufacturing and advanced packaging continue to gain momentum.
Release time:
2025-02-27
Thanks to strong policy support, cyclical industry changes, innovation-driven growth, and the accelerated promotion of domestic substitution, the localization rate has significantly increased across multiple sub-sectors—from IC design and wafer fabrication and packaging/testing to equipment and materials—marking that China’s semiconductor industry is steadily moving toward greater self-reliance and controllability.
The localization rate of semiconductor materials continues to rise further.
In 2025, the global semiconductor production capacity is expected to grow at an annual rate of 6.6%, reaching 33.6 million wafers per month. Among these, mainstream process capacity will increase by 6%, reaching 15 million wafers per month. Compared to advanced processes, mature processes feature lower process node sizes and moderate requirements for semiconductor materials. This presents a rare opportunity for domestic Chinese semiconductor material manufacturers, who can leverage this chance to integrate their products into the supply chain system.
HFCVD Diamond Film Deposition Equipment
China’s high demand will continue to drive growth in equipment sales.
Since the 13th Five-Year Plan, a series of policy measures—including “Made in China 2025,” the 14th Five-Year Plan, and the National Integrated Circuit Industry Investment Fund (commonly known as the “Big Fund”)—have continued to step up their efforts, injecting strong momentum into the semiconductor equipment industry and establishing a comprehensive, multi-dimensional policy support system. By 2025, the equipment market is set to experience robust growth, with an estimated increase of 19.6%. This sharp surge is primarily driven by China’s sustained high demand. Currently, the development of industries such as artificial intelligence (AI), big data, and storage chips is propelling the global semiconductor industry toward a market size of one trillion U.S. dollars—and this trend will undoubtedly provide semiconductor equipment manufacturers with even more market opportunities and room for growth.
Production-grade high-vacuum magnetron sputtering/ion-assisted/multi-arc hybrid coating machine
The importance of advanced packaging in manufacturing processes is becoming increasingly prominent.
In 2025, advanced packaging will continue to play an even more critical role in semiconductor manufacturing processes, helping to optimize power efficiency, performance, and area while reducing costs. AI is driving demand for larger substrates with more layers and I/O capabilities. To sustain Moore’s Law and keep pace with the rapid innovation in the high-end computing market, advanced packaging has become a core strategy for meeting the demands of these high-performance applications.
Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine
Driven by the dual forces of technological innovation and market demand, Pengcheng Semiconductor presents cutting-edge technologies, core products, and solutions in the fields of semiconductor materials, semiconductor equipment, and advanced packaging.
Production-grade high-vacuum magnetron sputtering and ion-assisted composite coating machine
Company Introduction:
Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. was jointly founded by Harbin Institute of Technology (Shenzhen) and a team of engineers with many years of practical experience. The company is rooted at the intersection of technological and market frontiers, striving for innovation-led growth and sustainable development, addressing industry pain points and challenges in domestic substitution, and aiming to achieve independent and controllable supply chains.
Pengcheng Micro- and Nano-Technology (Shenyang) Co., Ltd. is a wholly-owned subsidiary of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd., serving as both a design center and a manufacturing base for semiconductor processes and equipment.
The company’s core business is micro- and nano-technology and high-end precision manufacturing. Specific application areas include the R&D and design, production and manufacturing, process technology services, and upgrade and retrofit of semiconductor equipment, as well as the development and prototyping of semiconductor processes. We can provide customers with process R&D and sample fabrication services.
The company boasts a talent team with a well-rounded knowledge structure, including a high-level materials and process research team centered around professors and doctoral researchers from Harbin Institute of Technology. Additionally, we have a team of senior equipment designers from the industrial sector, who bring over 20 years of experience in semiconductor material research, epitaxy technology development, and the design, production, and manufacturing of complete sets of equipment for semiconductor thin-film fabrication.
The company is affiliated with Harbin Institute of Technology (Shenzhen) and boasts advanced R&D equipment platforms and testing facilities for semiconductors, enabling it to conduct cutting-edge scientific research from a high starting point. Headquartered in Shenzhen, the company has the capability to develop, manufacture, and debug semiconductor equipment, as well as to carry out pilot-scale production and commercial sales of semiconductor materials and devices.
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Contact: Ms. Dai
Shenyang Office Address: No. 15, Wanghua South Street, Dadong District, Shenyang City, Liaoning Province
Shenzhen Headquarters Address: Building 1, Chongwen Park, Nanshan Zhiyuan, No. 3370 Liuxian Avenue, Nanshan District, Shenzhen City, Guangdong Province
Phone:+86-13632750017
Email:sales@hitnano-sy.com
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