Exhibition Invitation | Pengcheng Semiconductor cordially invites you to attend the 2025 China Materials Conference!


Release time:

2025-07-01

The “China Materials Conference 2025” will be held from July 5 to 8, 2025, at the Xiamen International Convention & Exhibition Center in Fujian Province. The conference is expected to attract 30,000 participants and will feature 115 domestic and international sub-conferences covering five major thematic areas: energy materials, environmental materials, advanced structural materials, functional materials, and materials design, preparation, and evaluation. In addition, a series of specialized forums will be organized, including a Youth Forum, a Special New Materials Forum, a Materials Education Forum, and a Materials Journals Forum. Furthermore, an International Exhibition of New Materials Research Instruments and Equipment will be held concurrently.

I. Introduction to the Meeting

The “China Materials Conference 2025” will be held from July 5 to 8, 2025, at the Xiamen International Convention & Exhibition Center in Fujian Province. The conference is expected to attract 30,000 participants and will feature 115 domestic and international sub-conferences covering five major thematic areas: energy materials, environmental materials, advanced structural materials, functional materials, and materials design, preparation, and evaluation. In addition, a series of specialized forums will be organized, including a Youth Forum, a Special New Materials Forum, a Materials Education Forum, and a Materials Journals Forum. Furthermore, an International Exhibition of New Materials Research Instruments and Equipment will also be held concurrently.

II. Booth Information

Pengcheng Semiconductor will bring forth technologies based on nano- and atomic-scale manufacturing. PVD/CVD Technology for high-quality thin-film fabrication. For example, single-crystal thin films can be prepared using magnetron sputtering, and magnetron sputtering can also be employed as a beam source in molecular-beam epitaxy. We look forward to your participation in the conference. Exhibition Hall: Hall C3, Booth No.: C3094. All are welcome to visit, offer guidance, and engage in technical exchanges.

III. Featured Products

* Preparation of single-crystal thin films using magnetron sputtering technology; application of magnetron sputtering as a beam source for molecular beam epitaxy.

* Magnetron sputtering technology solves the challenge of coating micro-holes with aspect ratios exceeding 10:1.

* Large-size polycrystalline diamond wafers used as heat sinks for high-power devices, high-frequency devices, and high-power lasers.

* Utilizing single-frequency or dual-frequency plasma-enhanced chemical vapor deposition technology, this is an ideal process equipment for depositing high-quality thin films such as silicon nitride and silicon oxide.

Molecular Beam Epitaxy Thin-Film Growth Equipment (MBE)

Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine

Production-grade high-vacuum magnetron sputtering/ion-assisted/multi-arc hybrid coating machine

Production-grade high-vacuum magnetron sputtering and ion-assisted composite coating machine

Research-oriented high-vacuum magnetron sputtering coating machine

HFCVD Hot-Wire Chemical Vapor Deposition Equipment

PECVD Plasma-Enhanced Chemical Vapor Deposition Equipment

4. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd.

Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. was jointly founded by Harbin Institute of Technology (Shenzhen) and a team of engineers with many years of practical experience. The company is rooted at the intersection of technological and market frontiers, striving for innovation-led growth and sustainable development, addressing industry pain points and challenges in domestic substitution, and aiming to achieve independent and controllable supply chains.

Pengcheng Micro- and Nano-Technology (Shenyang) Co., Ltd. is a wholly-owned subsidiary of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd., serving as both a design center and a manufacturing base for semiconductor processes and equipment.

The company’s core business is micro- and nano-technology and high-end precision manufacturing. Specific application areas include the R&D and design, production and manufacturing, process technology services, and upgrade and retrofit of semiconductor equipment, as well as the development and prototyping of semiconductor processes. We can provide customers with process R&D and sample fabrication services.

The company boasts a talent team with a well-rounded knowledge structure, including a high-level materials and process research team centered around professors and doctoral researchers from Harbin Institute of Technology. Additionally, we have an elite team of senior equipment designers from the industrial sector, who bring over 20 years of experience in semiconductor material research, epitaxy technology development, and the design, production, and manufacturing of complete sets of equipment for semiconductor thin-film fabrication.

The company is affiliated with Harbin Institute of Technology (Shenzhen) and boasts advanced R&D equipment platforms and testing facilities for semiconductors, enabling it to conduct cutting-edge scientific research from a high starting point. Headquartered in Shenzhen, the company has the capability to develop, manufacture, and debug semiconductor equipment, as well as to carry out pilot-scale production and commercial sales of semiconductor materials and devices.

V. Traffic Map of the Convention and Exhibition Center

VI. Forum Activities

 

News Center

Application of Magnetron Sputtering Technology in the Preparation of Core Thin Films for Key Components in Medical Imaging

In the ongoing evolution of modern medical imaging technology, magnetron sputtering has become a core process in the field of thin-film fabrication and is widely used in the manufacturing of critical components for medical imaging.

Principles, Classification, and Applications of Physical Vapor Deposition (PVD) Technology

Physical Vapor Deposition (PVD) is an advanced surface engineering technology that, under vacuum conditions, uses physical methods to convert a target material into gaseous atoms, molecules, or ions, which then deposit onto the substrate surface to form a thin film. Since its development in the early 20th century, PVD technology has become an important technique in modern additive manufacturing and functional coating applications, owing to its advantages such as environmental friendliness, controllable costs, minimal consumable usage, dense and uniform film properties, and strong adhesion between the film and substrate. PVD can be used on demand to fabricate functional thin films with properties including wear resistance, corrosion resistance, electrical conductivity, insulation, piezoelectricity, and magnetism, and is widely applied across various industries, including mechanical, electronic, construction, and medical sectors.

The TGV glass through-hole technology has achieved a significant breakthrough, and its application prospects continue to expand.

Recently, TGV (Through Glass Via) technology has made significant progress in the fields of materials processing and micro- and nano-manufacturing, drawing considerable attention from the semiconductor, advanced packaging, and emerging electronic device industries. With its outstanding electrical performance, high-frequency characteristics, and three-dimensional integration capabilities, TGV is emerging as one of the key technologies for next-generation high-density interconnects.

Diamond: Possessing potential that surpasses existing semiconductor materials, with an even broader range of future applications.

Diamond is used as a semiconductor material—and some scholars even hail it as the “ultimate semiconductor material” and the “ultimate room-temperature quantum material”—owing to its unique physical and chemical properties. Diamond is an ultra-wide-bandgap semiconductor that boasts exceptional electrical, optical, mechanical, thermal, and chemical characteristics. These properties give diamond broad application prospects in numerous fields.

Pengcheng Semiconductor: The Strategy, Tactics, and Survival Guide for a High-Tech Enterprise

The 15th China International Nanotechnology Industry Expo (referred to as "Nanoexpo") has successfully concluded amid widespread anticipation. This year's event featured one keynote speech, 15 parallel forums, and a total of 605 cutting-edge presentations. It also included an innovation and entrepreneurship competition and three supply-demand matchmaking sessions. The expo brought together over 150 national-level talents and more than 500 top experts from universities, research institutes, and enterprises both at home and abroad. With an exhibition area of 25,000 square meters, the event attracted over 350 leading global companies and institutions, showcasing more than 2,400 of the latest technological products and innovative applications in the global nanotechnology field. Over the three-day period, the total number of attendees reached nearly 27,500, making this year’s expo the largest in its history and elevating its influence to new heights.