Exhibition Invitation | Pengcheng Semiconductor cordially invites you to attend the 2025 China Materials Conference!
Release time:
2025-07-01
I. Introduction to the Meeting
The “China Materials Conference 2025” will be held from July 5 to 8, 2025, at the Xiamen International Convention & Exhibition Center in Fujian Province. The conference is expected to attract 30,000 participants and will feature 115 domestic and international sub-conferences covering five major thematic areas: energy materials, environmental materials, advanced structural materials, functional materials, and materials design, preparation, and evaluation. In addition, a series of specialized forums will be organized, including a Youth Forum, a Special New Materials Forum, a Materials Education Forum, and a Materials Journals Forum. Furthermore, an International Exhibition of New Materials Research Instruments and Equipment will also be held concurrently.
II. Booth Information
Pengcheng Semiconductor will bring forth technologies based on nano- and atomic-scale manufacturing. PVD/CVD Technology for high-quality thin-film fabrication. For example, single-crystal thin films can be prepared using magnetron sputtering, and magnetron sputtering can also be employed as a beam source in molecular-beam epitaxy. We look forward to your participation in the conference. Exhibition Hall: Hall C3, Booth No.: C3094. All are welcome to visit, offer guidance, and engage in technical exchanges.
III. Featured Products
* Preparation of single-crystal thin films using magnetron sputtering technology; application of magnetron sputtering as a beam source for molecular beam epitaxy.
* Magnetron sputtering technology solves the challenge of coating micro-holes with aspect ratios exceeding 10:1.
* Large-size polycrystalline diamond wafers used as heat sinks for high-power devices, high-frequency devices, and high-power lasers.
* Utilizing single-frequency or dual-frequency plasma-enhanced chemical vapor deposition technology, this is an ideal process equipment for depositing high-quality thin films such as silicon nitride and silicon oxide.
Molecular Beam Epitaxy Thin-Film Growth Equipment (MBE)
Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine
Production-grade high-vacuum magnetron sputtering/ion-assisted/multi-arc hybrid coating machine
Production-grade high-vacuum magnetron sputtering and ion-assisted composite coating machine
Research-oriented high-vacuum magnetron sputtering coating machine
HFCVD Hot-Wire Chemical Vapor Deposition Equipment
PECVD Plasma-Enhanced Chemical Vapor Deposition Equipment
4. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd.
Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. was jointly founded by Harbin Institute of Technology (Shenzhen) and a team of engineers with many years of practical experience. The company is rooted at the intersection of technological and market frontiers, striving for innovation-led growth and sustainable development, addressing industry pain points and challenges in domestic substitution, and aiming to achieve independent and controllable supply chains.
Pengcheng Micro- and Nano-Technology (Shenyang) Co., Ltd. is a wholly-owned subsidiary of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd., serving as both a design center and a manufacturing base for semiconductor processes and equipment.
The company’s core business is micro- and nano-technology and high-end precision manufacturing. Specific application areas include the R&D and design, production and manufacturing, process technology services, and upgrade and retrofit of semiconductor equipment, as well as the development and prototyping of semiconductor processes. We can provide customers with process R&D and sample fabrication services.
The company boasts a talent team with a well-rounded knowledge structure, including a high-level materials and process research team centered around professors and doctoral researchers from Harbin Institute of Technology. Additionally, we have an elite team of senior equipment designers from the industrial sector, who bring over 20 years of experience in semiconductor material research, epitaxy technology development, and the design, production, and manufacturing of complete sets of equipment for semiconductor thin-film fabrication.
The company is affiliated with Harbin Institute of Technology (Shenzhen) and boasts advanced R&D equipment platforms and testing facilities for semiconductors, enabling it to conduct cutting-edge scientific research from a high starting point. Headquartered in Shenzhen, the company has the capability to develop, manufacture, and debug semiconductor equipment, as well as to carry out pilot-scale production and commercial sales of semiconductor materials and devices.
V. Traffic Map of the Convention and Exhibition Center
VI. Forum Activities
News Center
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Contact: Ms. Dai
Shenyang Office Address: No. 15, Wanghua South Street, Dadong District, Shenyang City, Liaoning Province
Shenzhen Headquarters Address: Building 1, Chongwen Park, Nanshan Zhiyuan, No. 3370 Liuxian Avenue, Nanshan District, Shenzhen City, Guangdong Province
Phone:+86-13632750017
Email:sales@hitnano-sy.com
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