Micro- and nano-technology and high-end precision manufacturing
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Semiconductor and general semiconductor fields
Manufacturers of R & D, design and production of semiconductor materials, engineering and equipment
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Production-Type TGV/TSV/TMV High-Vacuum Magnetron Sputtering Coater
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Production-type high-vacuum magnetron sputtering and ion-assisted composite coating machine
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Production-type high-vacuum magnetron sputtering ion-assisted multi-arc composite coating machine
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HFCVD hot wire chemical vapor deposition equipment
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PECVD plasma-enhanced chemical vapor deposition equipment is primarily used for the growth of silicon nitride and silicon oxide thin films in a clean, vacuum environment.
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HFCVD Hot-Wire Chemical Vapor Deposition Equipment
We have developed and manufactured hot-filament CVD diamond equipment, which is divided into two categories: experimental models and production-grade models. These devices are primarily used for the research and development and production of micrometer- and nanometer-sized diamond films. They can be applied to the R&D and manufacturing of diamond products across various performance levels, including mechanical, thermal, optical, and acoustic applications. We can produce large-size polycrystalline diamond wafers, which are suitable for use as heat sinks in high-power devices, high-frequency devices, and high-power lasers.
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Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine
Production-grade TGV/TSV/TMV high-vacuum magnetron sputtering coating system (Sputter-2000W series): This equipment is used for depositing metal seed layers on glass substrates and ceramic substrates, enabling high-density through-holes and blind vias with a depth-to-diameter ratio exceeding 10:1.
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The equipment features an overall cluster structure, comprising a photoelectric conversion thin-film deposition system, an MAMS electronic stripping system, a degassing and encapsulation system, a vacuum coating system for adsorbent materials, and a comprehensive degassing system. It enables fully automated, coordinated operation, while also allowing each subsystem to operate independently without interfering with one another. Interlocks can be configured between the systems. The equipment is manufactured from 316 material and is equipped with several flanged interfaces.
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MBE molecular beam epitaxy equipment
Molecular Beam Epitaxy (MBE) thin-film growth equipment—Molecular Beam Epitaxy MBE—enables epitaxial growth on certain substrates, allowing for the fabrication of molecular self-assembled structures, superlattices, quantum wells, one-dimensional nanowires, and more. It can also be used for process verification and the growth and fabrication of epitaxial wafers for both second-generation and third-generation semiconductors. During thin-film epitaxial growth, Molecular Beam Epitaxy equipment provides an ultra-high vacuum environment, enabling epitaxial growth under ideal conditions. This eliminates various interfering factors during film growth, resulting in high-precision thin films with exceptional accuracy.
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About Us
Pengcheng Micro- and Nano-Technology (Shenyang) Co., Ltd.
Pengcheng Micro Nano Technology (Shenyang) Co., Ltd. was jointly established by Harbin Institute of Technology (Shenzhen) and a team of experienced engineers with many years of practical experience. The company is based at the intersection of technological, market, and industrial frontiers, seeking innovation leadership and sustainable development, solving industry pain points and localization challenges, and striving for independent and controllable industrial chains. Pengcheng Micro Nano Technology (Shenyang) Co., Ltd. is a wholly-owned subsidiary of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. It is a design center and manufacturing base for semiconductor and pan semiconductor processes and equipment. The core business of the company is micro nano technology and high-end precision manufacturing, with specific application areas including research and development design, production and manufacturing of semiconductor and pan semiconductor materials, processes, equipment, process technology services, and equipment upgrading and transformation. It can provide process research and development and sampling for users, production equipment for manufacturing enterprises, and scientific research equipment for scientific research. The company's talent team has a complete knowledge structure, including a high-level materials research and process research team led by engineers, professors and PhDs from Harbin Institute of Technology, as well as a team of senior equipment designers from the industry. They have more than 30 years of experience in semiconductor material research, epitaxial technology research, and semiconductor thin film preparation equipment design and production manufacturing. The company relies on Harbin Institute of Technology (Shenzhen) and has advanced semiconductor research and development equipment platforms and testing equipment platforms, which can carry out scientific research work at a high starting point. The company is headquartered in Shenzhen and has the ability to conduct research and development, production, debugging of semiconductor and pan semiconductor equipment, as well as pilot testing, production, and sales of devices.
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Laboratory and R&D Center
Relying on the comprehensive experimental and testing & analysis platforms of Harbin Institute of Technology (Shenzhen), we provide support for R&D and production.
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2026-01-29
Principles, Classification, and Applications of Physical Vapor Deposition (PVD) Technology
2026-01-13
2026-01-05
2025-12-16
Contact: Ms. Dai
Shenyang Office Address: No. 15, Wanghua South Street, Dadong District, Shenyang City, Liaoning Province
Shenzhen Headquarters Address: Building 1, Chongwen Park, Nanshan Zhiyuan, No. 3370 Liuxian Avenue, Nanshan District, Shenzhen City, Guangdong Province
Phone:+86-13632750017
Email:sales@hitnano-sy.com
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