Diamond heat-dissipating wafer
With the rapid advancement of electronic information technology and micro- and nano-manufacturing technologies, the feature sizes of electronic components have shrunk to the micro- and nanoscale. The increasing integration and power levels of electronic components have made thermal management a major bottleneck restricting the development of electronic devices. Consequently, the development of high-performance thermal management materials has become a key driving force behind the growth of the electronic information industry. As a substrate for high-frequency, high-power devices, diamond is an ideal choice for reducing thermal resistance.
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