PRODUCTS CENTER
Ultra-high vacuum, high-energy pulsed magnetron sputtering coating equipment utilizes nanoscale and atomic‑level manufacturing techniques in an ultra‑clean environment to grow high‑purity, high‑quality thin films. One application scenario is the growth of GaN single crystal thin films and the realization of processes for preparing GaN‑based dilute magnetic semiconductor molecular structure materials.
High-vacuum magnetron sputtering coating equipment primarily employs rectangular magnetron sputtering targets to deposit films, including metallic, alloy, compound, semiconductor, ceramic, dielectric composite films, and other chemically reactive films. It is suitable for depositing various single-layer films, multilayer films, doped films, and alloy films, and can be used to coat both magnetic and non-magnetic materials.
The high-vacuum resistive thermal evaporation coating system employs resistive thermal evaporation technology. Under high-vacuum conditions, it deposits single‑layer or multi‑layer films of various compounds and mixtures onto substrates by heating the source material. It can be used for both physical and chemical research on materials. It is suitable for fabricating metal conductive electrodes, as well as for experimental studies on the physicochemical properties of organic materials, fundamental research on organic semiconductor devices, OLED research and development, and experimental studies on organic thin‑film solar cells.
The small single-tube LPCVD (Low-Pressure Chemical Vapor Deposition) equipment deposits various functional thin films—primarily Si₃N₄, SiO₂, and polysilicon films—on substrates via chemical vapor deposition under low-pressure, high-temperature conditions. It can be used for scientific research, practical teaching, and the fabrication of small-scale devices.